main feature:
l Tin-bismuth low-temperature solder powder,suitable for medium and low temperature soldering process or secondary reflowprocess；
l Strong moisturizing ability, good solderwettability for various devices and pads.
Wide process window
l Lowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
l high adhesion, keep the components attached.
Robust reflow performance
l Wide process window, making the reflowtemperature curve flexible；
l Bestwetting on all conventional substrate surfaces.
Good welding effect
l Goodthermal collapse, no tin beads, no bridge defects, few residues and transparent.
l The surface of the solder joint is bright, lesswrinkled, and low void
main feature:
l Tin-bismuth low-temperature solder powder,suitable for medium and low temperature soldering process or secondary reflowprocess；
l Strong moisturizing ability, good solderwettability for various devices and pads.
Wide process window
l Lowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
l high adhesion, keep the components attached.
Robust reflow performance
l Wide process window, making the reflowtemperature curve flexible；
l Bestwetting on all conventional substrate surfaces.
Good welding effect
l Goodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
l The surface of the solder joint is bright, lesswrinkled, and low void.
main feature:
l Tin-silver-based low-temperature solder powder,suitable for medium and low temperature soldering process or secondary reflowprocess；
l Strong moisturizing ability, good solderwettability for various devices and pads.
Wide process window
l Lowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
l high adhesion, keep the components attached.
Robust reflow performance
l Wide process window, making the reflowtemperature curve flexible；
l Bestwetting on all conventional substrate surfaces.
Good welding effect
l Goodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
l The surface of the solder joint is bright, lesswrinkled, and low void.
main feature:
l Tin-bismuthlow-temperature solder powder, suitable for medium and low temperaturesoldering process or secondary reflow process；
l Strong moisturizing ability, good solderwettability for various devices and pads.
Wide process window
l Lowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
l high adhesion, keep the components attached.
Robust reflow performance
l Wide process window, making the reflowtemperature curve flexible；
l Bestwetting on all conventional substrate surfaces.
Good welding effect
l Goodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
l The surface of the solder joint is bright, lesswrinkled, and low void.
